Thermal Cooling Paste

High quality – Special Properties: High conductivity, Lowbleed, Stable at high temperatures – Primary Use: Thermal coupling of electronic devices to heat sinks – Thermal Conductivity • Thermal paste is a type of material used to fill the gap between the CPU and the heat sink, and this material is also referred to as a thermal interface material. Its function is to transfer the heat radiated by the CPU to the heat sink, keep the CPU temperature at a level that can work stably, prevent the CPU from being damaged due to poor heat dissipation, and prolong the service life. • Composed of Carbon Micro-particles it acts on electronic components, electricians, household appliances, LCDs, LEDs, CPU coolers and other products to increase heat transfer function, filling gaps, insulation, waterproof, moisture, shockproof, etc • Heatsink Compounds Thermal Paste HY510 is also Easy to Apply • Additionally has High Durability wetting the contact surface sufficiently to form a very low heat resistance surface, which is much more efficient than other heat sink products.